|
 |
您現(xiàn)在的位置:IC 測(cè)試座(IC Test and Burn-In Socket) |
|
|
菱美電子專業(yè)代理及經(jīng)銷各式IC測(cè)試座,IC測(cè)試夾具,老化測(cè)試座,電源模塊測(cè)試座,品牌包括:ENPLAS,YAMAICHI,3M,TI,Wellscti,Plastronics,Advanced
Interconnection 表貼BGA插座,Meritec表貼SOP插座等等.測(cè)試座封裝含概:BGA,CSP,PGA,QFN,LGA,QFP,TSOP,SOP,PLCC,SOJ,DIP,TO等.并且可以根據(jù)客戶要求定制BGA測(cè)試座.
|
 |
|
BGA
Socket / BGA測(cè)試/老化座 |
 |
|
菱美電子提供最全的BGA測(cè)試插座產(chǎn)品,部分BGA插座貨期更短至2-3周。并可根據(jù)客戶的BGA器件出腳,定制合適的BGA插座。
|
IC Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
|
BGA
Surface Mount Socket(表貼) |
 |
|
-
No soldering of the BGA device required.
-
Same footprint as BGA device.
-
Compact, low-profile design maximizes PC
board space and requires no external
hold-downs.
-
Hundreds of footprints available from
1.5mm
down to 0.75mm pitch.
-
該BGA測(cè)試座系統(tǒng)為BGA, LGA or CSP
芯片的測(cè)試、替換、維修、升級(jí)提供了最經(jīng)濟(jì)的解決方案.
|
IC Test and Burn-In Socket - LingMei Electronic |
 |
|

|
QFN
Socket \ MLF socket |
 |
|
-
Available in .40, .50, .65, .80 and 1.00 mm
pitches
-
Custom pitches down to .30 mm
-
Lidded and Open Top Sockets for 3 mm - 10 mm
packages
-
Hundreds of footprints available from 1.5mm
down to 0.75mm pitch.
-
Lidded Sockets for 10 - 16 mm packages
-
Center ground pin standard for all sockets
-
Optional copper heat slug available for high
wattage devices
-
Sockets for over 80 different JEDEC standard
footprints
|
IC Test and Burn-In Socket - LingMei Electronic |
 |
|
  |
PGA
Socket / PGA測(cè)試/老化座 |
菱美電子提供最全的PGA測(cè)試/老化插座,產(chǎn)品分為2.54mm及1.27mm兩重規(guī)格,品牌包括:3M™ Textool™
,WELLS-CTI,Advanced Interconnections及YAMAICHI等. |
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
|
QFP
Socket / QFP測(cè)試/老化座 |
 |
|
-
Pin counts 32 to 304
-
Pitch sizes 0.4, 0.5, 0.635, 0.65, 0.8 and 1.0mm
-
High reliability, durability and temperature
range
-
Custom made also available for high pin
count and fine
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
  |
|
SOP
Socket |
 |
|
Pin Count:16
to 88
Pitch:0.5
to 1.27 |
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
|
TSOP
Socket |
 |
|
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
|
SOP
Surface Mount
Socket |
 |
|
980020-48-01,980020-48-02
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
  |
|
DIP
測(cè)試座 / 國(guó)產(chǎn)DIP老化測(cè)試座 |
 |
|
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
|
SOJ
Socket |
 |
|
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
  |
PLCC
Socket |
 |
|
|
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
SOT
Socket/晶體管測(cè)試座/電源模塊測(cè)試座 |
 |
|
SOT23-3 SOT23-3
SOT23-5 SOT23-6 SOT323 SOT353 SOT363(SC70)
SOD123 S0D323 SOD523 SC75 SOT89 SOT223 |
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
 |
TO測(cè)試座
/ 國(guó)產(chǎn)TO老化測(cè)試座 |
 |
|
TO-92 TO-220 TO-3P TO252 TO263 |
IC
Test and Burn-In Socket - LingMei Electronic |
 |
|
|
|
|
|
|