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The SMT adapter with solder balls emulate the chip’s BGA footprint and is easily installed using standard flux and reflow techniques. The adapters have the same solder ball types as the IC’s they are emulating. You can combine the SMT foot with the E-tec “Twist Lock Socket” or any other socket style The corresponding male BGA socket, through hole type, is plugged into the adapter. We offer any pin-out, configuration and grid size for pitch 0.80mm, 1.00mm and 1.27mm.
solderball sockets

2 Contact (Terminal & Contact Clip)                       Material: Terminal CuZn (RoHS compliant)
 (accepts 0.20mm – 0.30mm diameter pins)                        Contact Clip BeCu (RoHS compliant)

3 Solder Ball Material: Sn63Pb 37 (NON RoHS compliant)
                                         Sn96.5 Ag 3.0 Cu 0.5 (RoHS compliant)

Operating Temparature: -55°C to +125°C      Processing Temperature: 260°C for 60 sec.